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According to press accounts of remarks by the chairman of AUO, a Taiwanese display-panel maker, on the earnings call, TSMC has paid NT$38.8 billion for two AUO display panel plants, to convert into CoWoS advanced packaging buildings.

AUO chairman Paul Peng said on the October 29 third-quarter earnings call that the board approved selling a Gen 5 and a Gen 7.5 panel plant, including some equipment, and that TSMC expects to gain about 5.9 million square feet of usable floor space. Expanding CoWoS in existing buildings saves TSMC time over new construction, but the accounts don't say how much capacity the conversion adds or when it comes online. CoWoS is TSMC's advanced packaging that puts GPUs and high-bandwidth memory on one substrate, and is one of the bottlenecks in AI accelerator supply. All of this is reporter Dan Nystedt's relay of press reports on X; Nystedt has long compiled Taiwanese and Asian semiconductor news there (Dan Nystedt on X, 2026-10-29). How we checked →

Concept illustration set inside the screen of a flat-panel display whose bottom bezel is lettered "AUO AUO": on the left, a person stands on a raised ledge beside a building signed "tsmc TSMC" and tips a red sack of round beige discs onto a long slanted chute on posts. The discs roll down to the right, where a second person holds open a large pale sack in front of a building lettered "AUO AUO" and "PANEL PLANTS", with machinery visible through its two open bays.

Source and checks

This item ran in the brief of Oct 30, 2026, alongside 13 other items. How we checked it, the quote checks and what was still missing that day are on that issue's How we checked page.

Cite this item

SecondSource (2026). "According to press accounts of remarks by the chairman of AUO, a Taiwanese display-panel maker, on the earnings call, TSMC has paid NT$38.8 billion for two AUO display panel plants, to convert into CoWoS advanced packaging buildings.." https://secondsource.io/en/news/2026-10-30-5/. Accessed access date.